Methods of adjustment free manufacture of focus free camera modules

摘要

Methods are provided for wafer scale manufacturing camera modules without adjustment components to compensate for assembly errors and optical errors incurred within manufacturing tolerances. Camera modules are assembled in wafer arrays from arrays of image sensors, arrays of lens structures and arrays of optical trim elements. At least one of the arrays is a wafer. Lens structures are configured to provide less optical power than necessary to focus an image at infinity on image sensors without trim elements. A test performed during the wafer scale assembly of camera modules, after at least the sensor array and the lens structure array assembled, determines optical errors by identifying optical distortions and aberrations quantified in terms of optical power, astigmatism, coma, optical axis shift and optical axis reorientation deficiencies. Corresponding trim elements are configured to counteract distortions and aberrations prior to singulating useful camera modules from the array.