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Semiconductor device including a cell array having first cells and second cells interspersed around the arrangement of the first cells

机译:半导体器件包括具有第一单元和第二单元的单元阵列,第二单元散布在第一单元的布置周围

摘要

A semiconductor device that can achieve a high-speed operation at a time of switching, and the like. The semiconductor device includes: a p-type buried layer buried within an n-type semiconductor layer; and a p-type surface layer formed in a central portion of each of cells. In a contact cell, the p-type buried layer is in contact with the p-type surface layer. The semiconductor device further includes: a p+-type contact layer formed on the p-type surface layer of the contact cell; and an anode electrode provided on the n-type semiconductor layer. The anode electrode forms a Schottky junction with the n-type semiconductor layer and forms an ohmic junction with the p+-type contact layer.
机译:可以在切换等时实现高速操作的半导体器件。该半导体器件包括:p型掩埋层,该p型掩埋层掩埋在n -型半导体层内。在每个单元的中央部分形成p型表面层。在接触单元中,p型掩埋层与p型表面层接触。该半导体器件还包括:在接触单元的p型表面层上形成的p + 型接触层;和阳极电极设置在n -型半导体层上。阳极电极与n -型半导体层形成肖特基结,并与p + 型接触层形成欧姆结。

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