A process and apparatus for cooling heat intensive components such as printed circuit boards and mechanical systems using low to zero technology

摘要

Primarily for use in data centres to improve PUE factors (power usage effectiveness) but with applications across all heat generated processes, the invention provides free cooling to electronic components and areas by utilising the unwanted energy from the heat-sink/ heat source. The invention can be used but non restricted to the following applications: electronic components, refrigeration systems, exhaust manifolds for automotive and aeronautic cooling systems, rail systems, advanced office lighting technology, Power station and turbine systems, water creation technology and small scale desalination. Figure 1