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Procedure for obtaining intercept point third-order integrated into a semiconductor crystal linear analog circuits by measuring temperature

机译:通过测量温度获得集成到半导体晶体线性模拟电路中的截点三阶的过程

摘要

Procedure for obtaining intercept point third-order integrated in a semiconductor crystal by measuring temperature linear analog circuits. # The present invention describes a method for measuring the linearity integrated in a semiconductor crystal linear analog circuits, to by obtaining the point of third order intercept by measuring temperature. Fig. 1 shows a digital semiconductor crystal (1) which may contain different analog circuits and / or (2, 3, 4, 5), one of which is a linear analog circuit, in this case an amplifier (2). Operation of said amplifier causes power dissipation and this increased surface temperature of the semiconductor crystal. With proper sequence of stimuli, measurements of certain frequency components of said temperature conducted near the amplifier circuit (7), allow to obtain the point of third order intercept amplifier, which is a parameter used to quantify the linearity in systems such as receivers, amplifiers or mixers. The temperature measurement can be done either by temperature sensors integrated on the same semiconductor crystal or by external sensors.
机译:通过测量温度线性模拟电路来获得集成在半导体晶体中的截点三阶的过程。本发明描述了一种用于测量集成在半导体晶体线性模拟电路中的线性度的方法,以通过测量温度来获得三阶截距点。图1示出了数字半导体晶体(1),其可以包含不同的模拟电路和/或(2、3、4、5),其中之一是线性模拟电路,在这种情况下是放大器(2)。所述放大器的操作导致功率耗散以及半导体晶体的这种升高的表面温度。通过适当的刺激顺序,在放大器电路(7)附近进行的所述温度的某些频率分量的测量允许获得三阶截取放大器的点,该点是用于量化系统(例如接收器,放大器)中的线性度的参数或搅拌机。可以通过集成在同一半导体晶体上的温度传感器或外部传感器来完成温度测量。

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