首页>
外国专利>
HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS
HIGHLY SCALABLE FABRICATION TECHNIQUES AND PACKAGING DEVICES FOR ELECTRONIC CIRCUITS
展开▼
机译:电子电路的高度可扩展的制造技术和包装设备
展开▼
页面导航
摘要
著录项
相似文献
摘要
Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.
展开▼