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Method and apparatus for preventing galvanic corrosion in semiconductor processing
Method and apparatus for preventing galvanic corrosion in semiconductor processing
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机译:防止半导体加工中的电偶腐蚀的方法和装置
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摘要
The present invention is related to a method and apparatus for cleaning a semiconductor substrate (1,13) comprising on a surface of the substrate at least one structure (5) comprising a first conducting or semiconducting material, surrounded by a layer (4) of a second conducting or semiconducting material, said layer essentially extending over the totality of said surface, said first and second material being in physical contact, the method comprising the steps of:- Providing said substrate (1),- Positioning a counterelectrode (20,30) facing said substrate surface,- supplying an electrolytic fluid (21) to the space between said surface and the electrode, said counterelectrode acting as an anode in the galvanic cell defined by the substrate surface, the cleaning fluid (21) and the counterelectrode (20,30).
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