Room-temperature bonding method and room-temperature bonding apparatus

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus for room temperature joining, which evenly form an intermediate material on the surface of a substrate, need no heating at the time of joining, and secure sufficient joint strength even in joining at room temperature.;SOLUTION: The method for room temperature joining is used for joining a plurality of substrates 4 via an intermediate material at room temperature, and includes a step of forming intermediate materials on the to-be-joined surfaces of the substrates by subjecting a plurality of targets 7 to physical sputtering, and a step of activating the to-be-joined surfaces with ion beams. In this case, the targets subjected to physical sputtering are preferably composed of a plurality of kinds of materials. The intermediate materials are sputtered from a plurality of targets that are arranged in various directions as seen from the to-be-joined surfaces of the substrates, so that the intermediate materials are evenly formed on the to-be-joined surfaces. Further, since the intermediate materials are composed of a plurality of kinds of materials, the room temperature joining of the substrates that are hard to join with an intermediate material composed of a single kind of material is realized without requiring heating or excessive joining pressure at the time of joining.;COPYRIGHT: (C)2008,JPO&INPIT