CERAMIC WIRING SUBSTRATE, CERAMIC GREEN SHEET FOR CERAMIC WIRING SUBSTRATE, AND GLASS CERAMIC POWDER FOR CERAMIC WIRING SUBSTRATE

摘要

A ceramic wiring substrate (1) comprises a ceramic substrate (10) and an internal conductor (20). The internal conductor (20) is arranged in the ceramic substrate (10). The ceramic substrate (10) comprises a glass, a first ceramic filler and a second ceramic filler. The thermal expansion coefficient of the first ceramic filler as measured in a temperature range from -40ºC to +125ºC is lower than the thermal expansion coefficient of the second ceramic filler as measured in a temperature range from -40ºC to +125ºC. The three-point bending strength of the second ceramic filler is higher than the three-point bending strength of the first ceramic filler.