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METHOD FOR GENERATING INTERMETALLIC COMPOUND, AND METHOD FOR CONNECTING ARTICLES TO BE CONNECTED BY USING INTERMETALLIC COMPOUND

机译:生成金属间化合物的方法以及使用金属间化合物连接待连接的文章的方法

摘要

Provided is a method for generating an intermetallic compound, wherein: a first metal and a second metal are favorably diffused when generating the intermetallic compound; an intermetallic compound having a high melting point can be generated at a low temperature and in a short amount of time; low-melting point components are not left behind after generating the intermetallic compound; and an intermetallic compound having excellent strength at high temperatures can be obtained. This method for generating an intermetallic compound involves generating an intermetallic compound having a higher melting point than that of the first metal by heating the first metal and the second metal, which has a higher melting point than that of the first metal, to a temperature at or above the melting point of the first metal. The first metal is Sn or an alloy containing Sn, while the second metal is an Ni-Cr alloy, an Ni-V alloy, an Ni-Pd alloy, an Ni-Pt alloy, or an Ni-Au alloy.
机译:本发明提供一种金属间化合物的生成方法,其中,在生成金属间化合物时,第一金属和第二金属良好地扩散。可以在低温和短时间内产生具有高熔点的金属间化合物。生成金属间化合物后不遗留低熔点成分。可以得到高温强度优异的金属间化合物。该生成金属间化合物的方法包括通过将第一金属和熔点比第一金属的熔点高的第二金属加热到200℃的温度来生成熔点比第一金属的熔点高的金属间化合物。或高于第一金属的熔点。第一金属是Sn或包含Sn的合金,而第二金属是Ni-Cr合金,Ni-V合金,Ni-Pd合金,Ni-Pt合金或Ni-Au合金。

著录项

  • 公开/公告号WO2015079845A1

    专利类型

  • 公开/公告日2015-06-04

    原文格式PDF

  • 申请/专利权人 MURATA MANUFACTURING CO. LTD.;

    申请/专利号WO2014JP78459

  • 发明设计人 NAKANO KOSUKE;TAKAOKA HIDEKIYO;

    申请日2014-10-27

  • 分类号C22C1;B23K1/19;B23K35/26;B23K35/30;C22C1/02;C22C19/03;H01L21/52;H05K3/34;

  • 国家 WO

  • 入库时间 2022-08-21 15:06:15

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