HEAT SINK, ELECTRONIC DEVICE, STRUCTURE FOR FIXING HEAT SINK

摘要

Provided is a heat sink that can be fixed irrespective of the mounting position on a substrate, an electronic device provided with the heat sink, and a structure for fixing the heat sink. The heat sink is provided with a heat dissipation part and a fixing part. The heat dissipation part has: a base on an electronic component provided on the substrate; fins provided on the base; and a guide pin. The fixing part has: an opening part into which the guide pin is inserted; a pressure contact part provided on the fins; and two or more fixing pieces inserted into and fixed in holes in the substrate. The fixing part fixes the heat dissipation part on the electronic component.