ISOSTATIC PRESS CAPABLE OF PERFORMING HEATING AND COOLING AND METHOD FOR MANUFACTURING CHIP COMPONENT USING SAME

摘要

The present invention relates to an isostatic press for performing a compression molding by a fluid and a gas which are filled in a pressure vessel. The isostatic press according to an embodiment of the present invention corresponds to an isostatic press device comprising a pressure vessel, which has a receiving groove for receiving a workpiece to be processed and a pressurizing medium filled in the receiving groove to apply an isostatic pressure to the workpiece, wherein the isostatic press comprises a heat exchanger having a heat-exchanging member disposed in the receiving groove to exchange heat with the pressurizing medium so as to heat or cool the pressurizing medium. Therefore, the isostatic press can heat and cool the workpiece in a short time, and obtain a workpiece having a dense texture, thereby minimizing the defect rate of the workpiece.