ISOSTATIC PRESS CAPABLE OF PERFORMING HEATING AND COOLING AND METHOD FOR MANUFACTURING CHIP COMPONENT USING SAME

摘要

Disclosed is an isostatic press capable of carrying out compression molding using a fluid or a gas filled in a pressure vessel. The isostatic press having the pressure vessel having an accommodation chamber for receiving a workpiece therein, in which the accommodation chamber is filled with a pressure medium to apply isostatic gas pressure to the workpiece, includes a heat exchanger including a heat exchange member which is installed to the accommodation vessel and transfers heat between the pressure medium and the heat exchange member to heat or cool the pressure medium supplied to the accommodation chamber. Accordingly, the isostatic press can heat or cool the workpiece in a short time, thereby obtaining the workpiece having a dense structure and minimizing a fraction defective of the workpiece.