PROCESSING METHOD FOR SUPERHYDROPHOBIC COPPER SUBSTRATE SURFACE AND COPPER SUBSTRATE HAVING THE SUPERHYDROPHOBIC SURFACE PREPARED WITH THE SAME

摘要

The present invention relates to a method for processing a superhydrophobic copper (Cu) substrate surface and a Cu substrate having a superhydrophobic surface prepared using the same. More specifically, the present invention relates to a method for processing a superhydrophobic copper (Cu) substrate surface includes the steps of: etching a Cu substrate using an aqueous solution including halogen ions to form a micro-teras structure (Step 1), and forming a hierarchy structure having a derived nano-leaf structure on the micro-teras structure by processing the Cu substrate having the micro-teras structure formed on the surface thereof using aqueous solution including persulfate and a hydroxyl group (step 2), and a Cu substrate having a superhydrophobic surface prepared using the same. According to the present invention, the surface of the Cu substrate is processed using the aqueous solution including halogen ions to form the micro-teras structure, and the nano-leaf structure is formed using the aqueous solution including persulfate and a hydroxyl group, so that the superhydrophobic surface can be realized through an economical and simple process. After the hierarchy structure is formed on the Cu substrate, the surface of the Cu substrate is modified using fluorine compounds, so that an excellent superhydrophobic property can be realized. In addition, the Cu substrate manufactured through the method can have excellent durability. Accordingly, the structure is not deformed at a normal temperature for a long perid of time, so that there is no limitation in the superhydrophobic temperature and time, so the Cu substrate can be usefully used in various fields.