LOW TEMPERATURE-CURABLE PHOTOSENSITIVE COMPOSITION FOR SOLDER RESIST OF FLEXIBLE PRINTED CIRCUIT BOARD

摘要

Provided in the present invention is a low temperature-curable photosensitive composition for a solder resist, which includes a modified epoxy resin, a photo-curable resin, an urethane acrylate oligomer, a photo-curable monomer, a photopolymerization initiator, a thermal curing agent, and an organic solvent, wherein the thermal curing agent is characterized by being one or more methylated polyalkylene polyamine blocked by a phenol resin, and having one primary or secondary amine and two or more tertiary amines. The low temperature-curable photosensitive composition for a solder resist according to the present invention can form an excellent film by heating and curing at about 100°C or less after forming a pattern by photo-curing. Moreover, the low temperature-curable photosensitive composition for a solder resist according to the present invention can form an excellent film having excellent properties demanded for a solder resist of a flexible printed circuit board like adhesion, flexibility, strength, dimensional stability, welding heat resistance, electrical insulating properties.;COPYRIGHT KIPO 2015