BOARD FLIP-TYPE LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
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机译:板翻转式激光加工装置及激光加工方法
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摘要
The present invention relates to a kind of substrate board treatment, be capable of flip-type laser processing laser processing substrate be reversed the laser treatment that foreign matter generation is prevented in face-down mode during from investing substrate and laser processing. Substrate flip-type laser processing device includes: chamber housing carrier, on carrier upper plate; Carrier lifting device is mounted in the chamber to be elevated with carrier; Substrate turnover device is mounted in the chamber, and is overturn the carrier and promoted by carrier lifting device, so that the surface guidance of processing substrate moves down; It is overturn with the radiation device substrate of laser emission, by substrate turnover device, is mounted on transmission with laser light. ;The 2015 of copyright KIPO submissions
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