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BOARD FLIP-TYPE LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

机译:板翻转式激光加工装置及激光加工方法

摘要

The present invention relates to a kind of substrate board treatment, be capable of flip-type laser processing laser processing substrate be reversed the laser treatment that foreign matter generation is prevented in face-down mode during from investing substrate and laser processing. Substrate flip-type laser processing device includes: chamber housing carrier, on carrier upper plate; Carrier lifting device is mounted in the chamber to be elevated with carrier; Substrate turnover device is mounted in the chamber, and is overturn the carrier and promoted by carrier lifting device, so that the surface guidance of processing substrate moves down; It is overturn with the radiation device substrate of laser emission, by substrate turnover device, is mounted on transmission with laser light. ;The 2015 of copyright KIPO submissions
机译:本发明涉及一种基板处理,能够进行倒装式激光加工,在进行基板投资和激光加工时,以面朝下的方式逆转防止异物产生的激光处理。基板翻转型激光加工装置包括:腔室壳体托架,在托架上板上;以及托架升降装置安装在腔室内,以便与托架一起升高;基板翻转装置安装在腔室内,翻转托架并由托架提升装置推动,使处理基板的表面导向向下移动;用激光发射的辐射装置将其翻转,通过基板翻转装置,将其安装在具有透射光的激光上。 ; 2015年版权KIPO提交文件

著录项

  • 公开/公告号KR20150004468A

    专利类型

  • 公开/公告日2015-01-13

    原文格式PDF

  • 申请/专利权人 WONIK IPS CO. LTD.;

    申请/专利号KR20130076976

  • 发明设计人 CHOI JUN SOO;HAN JAE BYUNG;CHOI CHANG NAM;

    申请日2013-07-02

  • 分类号B23K26/08;B23K26/38;

  • 国家 KR

  • 入库时间 2022-08-21 15:00:54

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