Processing High Density Boards with UV Lasers

摘要

Over the past few years, there has been a noted increase in the use of UV lasers in the organic substrate industry (Printed Wire Boards (PWB) and IC Packaging). The primary driver that can be attributed to this growth is the increasing adoption of microvias, but there are other application areas, such as precision profiling/routing and soldermask ablation that have also fueled the adoption of laser technology. This article will attempt to give some framework for understanding the drilla-bility or laser processibility of the common PWB materials.