A laser processing method for a wiring board, a laser processing apparatus for a wiring board, and a carbon dioxide gas laser oscillator for processing a wiring board

摘要

There is a problem that when the wiring board including the glass cloth is processed by using a laser beam, protrusion of the glass cloth occurs and the machining hole becomes coarse and the heating time is long and thus a carbonized layer is generated on the wall surface of the machining hole there was. The laser beam is irradiated pulsed with a beam irradiation time ranging from about 10 占 퐏 to about 200 占 퐏 at an energy density of not less than about 20 J / cm2 for the work of the wiring substrate, and the through hole or the blind via hole And is a laser processing method for a wiring board that performs perforation, grooving, or external cutting.