ULTRA-THIN GOLD-PALLADIUM ALLOY PLATING SOLUTION FOR FORMING PPF PLATING LAYER OF SEMICONDUCTOR LEAD FRAME

摘要

According to the present invention, disclosed is an ultra-thin gold-palladium alloy plating solution for forming the PPF plating layer of a semiconductor lead frame. The ultra-thin gold-palladium alloy plating solution for forming the PPF plating layer of a semiconductor lead frame is a plating solution which forms a plating layer on the surface of a lead frame during a semiconductor manufacturing process. The plating solution includes at least one selected from a group comprising potassium gold (I) cyanide, potassium gold (III) cyanide, gold (III) chloride hydrate, and sodium gold sulfite; and at least one selected from a group comprising dichloro tetraammonium palladium, palladium chloride anhydrous, palladium (II) acetate, palladium (II) nitrate, and palladium (II) cyanide. Accordingly, the manufacturing efficiency of a semiconductor process can be increased by securing adhesion, corrosion resistance, and wirebondability properties.;COPYRIGHT KIPO 2015