PALLADIUM PLATING SOLUTION, PALLADIUM PLATING FILM FORMED USING THE SOLUTION AND LEAD FRAME FOR SEMICONDUCTOR APPARATUSES HAVING THE PALLADIUM PLATING FILM

摘要

A PALLADIUM PLATING FILM HAVING EXCELLENT SOLDERING CHARACTERISTICS, INCLUDING EXCELLENT SOLDER WETTABILITY, HIGH SOLDER WETTING SPEED, AND ESPECIALLY THE MAINTENANCE OF THESE CHARACTERISTICS IN A HIGH-TEMPERATURE ATMOSPHERE, IS PRODUCED BY USING A PALLADIUM PLATING SOLUTION. THE PALLADIUM PLATING FILM CAN BE USED, FOR EXAMPLE, FOR THE PLATING OF ELECTRICAL AND ELECTRONIC PARTS. THE PALLADIUM PLATING SOLUTION USED CONTAINS A SOLUBLE PALLADIUM SALT AND A QUATERNARY COMPOUND, AND, IF NECESSARY, FURTHER CONTAINS A PYRIDINE DERIVATIVE OR A SALT THEREOF, AND OPTIONALLY FURTHER CONTAINS AT LEAST ONE COMPOUND SELECTED FROM AMMONIUM CHLORIDE, AMMONIUM HYDROGENPHOSPHATE, AMMONIUM NITRATE, AMMONIUM SULFATE, AMMONIUM CHLORIDE AND BORIC ACID OR A SOLUBLE SELENIUM SALT. FIGURE 2.