SURFACE-TREATED COPPER FOIL AND LAMINATE USING SAME, COPPER-CLAD LAMINATE, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

摘要

Preferably adhered to the resin, and further, the surface of the transparency of the resin after removing the copper foil by etching process the copper foil and excellent laminate using the same, the copper clad laminate, and provides a printed wiring board and an electronic apparatus. At least a surface-treated copper foil roughening particles are formed by roughening the surface of one, the copper foil, and then combined to both sides adhesive preparation of the polyimide resin substrate, and etching to remove the copper foil on both sides, and to print a mark on the line-shaped prints crushing under the exposed polyimide substrate, when the substrate was taken with the CCD camera over the polyimide substrate, with respect to the image obtained by the photographing, the mark of the observed line shape of each observation point along the direction perpendicular to the direction of elongation Prepared by measuring the brightness, observation points of brightness in the graph, the top and the bottom average value the average value Bt of the difference B of Bb generated brightness over the portion without any mark from the end of the mark curve ( B = Bt - Bb) of 40 or more surface treated copper foil. ;