Photo-sensitive resin composition and protective film for printed circuit board having superior heat resistant and mechanical property

摘要

The present invention relates to a protective film for the heat resistance and mechanical properties are excellent photosensitive resin composition and a printed circuit board and, more particularly, an acid-modified oligomer, a photopolymerizable monomer, a photoinitiator, the epoxy resin and the state comprises an epoxy group in the chain and at least one double bond of butadiene modified epoxy resin, a photosensitive resin comprising the composition, and this printed circuit prepared by having It provides a protective film for the substrate.