BUMPLESS BUILD-UP LAYER AND LAMINATED CORE HYBRID STRUCTURES AND METHODS OF ASSEMBLING SAME

摘要

The structure includes a hybrid substrate supporting a semiconductive device comprising a bumpless buildup layer having a semiconductive device embedded therein and a laminated core structure. The bumpless buildup layer and the laminate core structure are integrated into the plated through hole in the laminate core structure and the reinforcing plating connected to the subsequent bond pads of the bumpless buildup layer structure.