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Bumpless build-up layer and laminated core hybrid structures and methods of assembling same
Bumpless build-up layer and laminated core hybrid structures and methods of assembling same
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机译:无撞堆积层和层压芯混合结构及其组装方法
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摘要
A structure includes a hybrid substrate for supporting a semiconductive device that includes a bumpless build-up layer in which the semiconductive device is embedded and a laminated-core structure. The bumpless build-up layer and the laminated-core structure are rendered an integral apparatus by a reinforcement plating that connects to a plated through hole in the laminated-core structure and to a subsequent bond pad of the bumpless build-up layer structure.
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