首页> 外国专利> A method for local reconstruction of mold problem areas on the inside of an outer sleeve of buildings and also the use of a largely impermeable to water vapor filling material having a highly heat-insulating properties

A method for local reconstruction of mold problem areas on the inside of an outer sleeve of buildings and also the use of a largely impermeable to water vapor filling material having a highly heat-insulating properties

机译:一种用于在建筑物的外套的内侧上局部重建模具问题区域的方法,并且还使用具有高绝热性能的对水蒸气填充材料基本上不可渗透的材料

摘要

The invention relates to a method for the local reconstruction of mold problem areas (10) on the inner side of an outer shell of a building, as well as the use of a largely impermeable to water vapor filling material having a highly thermally insulating properties in the form of a filler material or a foam as a replacement for the ground surface is removed on the inside of the outer shell of a building in the region of a geometric heat bridge. In order to permit a simple and sustainable repair of the heat caused by the geometrical of the outer mold problem areas (10) without manual special knowledge and construction of the invention is to enable the proposed according to the invention that, in the mold problem areas (10) background of the inner side of the outer shell is removed and in that a during removal of the constructional component, resulting recess (44) with a hardenable filling material (46) is filled, the highly heat insulating properties and for water vapor is impermeable to the greatest possible extent.
机译:本发明涉及一种用于在建筑物的外壳的内侧上局部重建霉菌问题区域(10)的方法,以及一种在建筑物中使用具有高绝热性能的水蒸气填充材料的不渗透性大的方法。在几何形状的热桥区域中,在建筑物外壳的内部去除了填充材料或泡沫的形式来代替地面。为了允许简单且可持续地修复由外部模具问题区域(10)的几何形状引起的热量,而无需人工专门知识,并且本发明的构造使得根据本发明的提议能够在模具问题区域中进行(10)去除外壳内侧的背景,并且在去除结构部件的过程中,填充具有可硬化的填充材料(46)的所得凹部(44),该凹部具有高度的隔热性能并且用于水蒸气在最大程度上是不可渗透的。

著录项

  • 公开/公告号DE102013011078A1

    专利类型

  • 公开/公告日2015-01-08

    原文格式PDF

  • 申请/专利权人 NIELS CHRISTIANSEN;

    申请/专利号DE20131011078

  • 发明设计人 GLEICH ANMELDER;

    申请日2013-07-03

  • 分类号E04G23/02;E04B1/76;

  • 国家 DE

  • 入库时间 2022-08-21 14:55:49

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