Process for diffusion soldering to form a diffusion zone as a solder joint and electronic assembly with such a solder joint

摘要

The invention relates to a method for diffusion soldering, in which an electronic component (13) is placed on a substrate (12). In this case, the joining surfaces are designed so that cavities (20) in the region of the joint gap (21) arise. This can be ensured, for example, by providing recesses in the mounting surface (18) of the component (13). The cavities (20) have the advantage that when the component (13) is placed on the contact surface (14) of the substrate (12), the solder material (19) can escape into the cavities in order to achieve the required width of the joining gap (21). Thus, the joint gap (21) can be selected so narrow that it forms during soldering with the joining gap (21) bridging diffusion zone. In this way, a Diffusionslötverbindung, advantageously even when using standard solders. Furthermore, the invention also relates to an electronic assembly (11), which was manufactured in the way described.