Determination method for resistance capacity for multiple structuring

摘要

One method includes generating a plurality of multiple patterning compounds associated with an integrated circuit layout. Each of the plurality of multiple structuring decompositions comprises a first structure connected to a first mask, a second structure connected to a second mask, the first mask and the second mask being two masks of a multiple patterning mask set, a width value associated with at least one of the first structure or the second structure is connected, and a distance value between the first structure and the second structure. A file is generated comprising a plurality of values of dielectric constant associated with the plurality of multiple patterning decompositions based on the widths and the distance values.