Surface-treated copper foil and the same comprehensive copper-lined laminate, using the same printed circuit board and method for producing the same

摘要

In this case, a surface-treated copper foil, a copper-clad laminate which is in the same comprises a printed circuit board, which is in the same is used, and a method for producing the same disclosed. In detail, the copper-lined laminate according to an implementation of guiding the form of the present invention: a support; a pull-off layer, which is formed on the support; a copper layer, which layer is formed on the extraction means comprises; and a surface-treated layer, which on the copper-clad layer is formed, wherein the surface-treated layer a connection on the thiol - base. Therefore the present invention provides for a printed circuit board, which an adhesive force between a base and a copper-clad layer may be improved without to treat a roughened surface, in that the surface-treated layer to layer is formed of the copper-clad.