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Temporary wafer bonding and temporarily bonded wafer
Temporary wafer bonding and temporarily bonded wafer
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机译:临时晶圆键合和临时晶圆键合
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摘要
Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer 5, is temporarily bonded to a substrate 1, followed by further processing of the active wafer.
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