TEMPORARY WAFER BONDING METHOD, BONDING COMPOSITION THEREFOR AND TEMPORARILY BONDED WAFER

摘要

Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.