首页> 外国专利> HEAT DISSIPATION STRUCTURE, POWER MODULE, METHOD FOR MANUFACTURING HEAT DISSIPATION STRUCTURE AND METHOD FOR MANUFACTURING POWER MODULE

HEAT DISSIPATION STRUCTURE, POWER MODULE, METHOD FOR MANUFACTURING HEAT DISSIPATION STRUCTURE AND METHOD FOR MANUFACTURING POWER MODULE

机译:散热结构,功率模块,制造散热结构的方法和制造功率模块的方法

摘要

A heat dissipation structure having high joining strength during a cooling/heating cycle and a high cooling efficiency, a power module, a method of manufacturing the heat dissipation structure, and a method of manufacturing the power module is provided. A power module 1 of the present invention includes: a ceramic substrate 10 having an insulation quality; a metal member 50 containing a metal or an alloy and joined by a brazing material on a surface of the ceramic substrate 10; and a heat dissipation member 40 formed by accelerating a powder containing a metal or an alloy with a gas, and by spraying and depositing the powder in a solid phase state on a surface of the metal member 50, wherein a heat pipe 60 is embedded in the heat dissipation member 40.
机译:提供了一种在冷却/加热循环期间具有高接合强度并且具有高冷却效率的散热结构,功率模块,制造该散热结构的方法以及制造功率模块的方法。本发明的功率模块1包括:绝缘性良好的陶瓷基板10;以及绝缘性高的陶瓷基板10。包含金属或合金并通过钎焊材料接合在陶瓷基板10的表面上的金属构件50;散热构件40,该散热构件40通过使含有金属或合金的粉末与气体一起加速而形成,并在金属构件50的表面上以固相状态喷雾并堆积而形成,在该金属构件50中埋设有热管60。散热构件40。

著录项

  • 公开/公告号EP2763166A4

    专利类型

  • 公开/公告日2016-01-27

    原文格式PDF

  • 申请/专利权人 NHK SPRING CO. LTD.;

    申请/专利号EP20120836204

  • 申请日2012-09-20

  • 分类号H05K1/02;B23P15/26;C23C24/04;F28D15/02;H01L21/48;H01L23/373;H01L23/427;H01L25/07;H01L25/18;H05K1/03;H05K7/20;

  • 国家 EP

  • 入库时间 2022-08-21 14:51:49

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