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DEFECT CORRECTION DEVICE AND DEFECT CORRECTION METHOD FOR SUBSTRATE AND DEFECT CORRECTION PART STRUCTURE FOR SUBSTRATE

机译:基材的缺陷校正装置和缺陷校正方法以及基材的缺陷校正部件结构

摘要

PROBLEM TO BE SOLVED: To appropriately correct the disconnected portion of an electrode pattern formed on a substrate by using paste-like conductive materials.SOLUTION: A defect correction device 100 includes: a squeegee probe 10; a Z stage 120; an XY stage 110; and a control device 200. The squeegee probe 10 shapes paste 4 applied to a disconnected portion 3. The control device 200 controls a Z stage 120 such that a distance D between the squeegee probe 10 and electrode patterns 21 and 22 becomes a predetermined value Dth, and controls the XY stage 110 to scan the squeegee probe 10 in a state that the distance D is held to be the predetermined value Dth. The predetermined value Dth is determined in accordance with a contraction amount by the burning of the paste 4.SELECTED DRAWING: Figure 8
机译:解决的问题:通过使用糊状导电材料来适当地校正形成在基板上的电极图案的不连续部分。解决方案:缺陷校正装置100包括:刮刀10;刮刀10;刮刀10;刮刀10;刮刀10。 Z台120; XY平台110;刮板探针10使施加到断开部分3上的糊剂4成形。控制装置200控制Z台架120,使得刮板探针10与电极图案21和22之间的距离D成为预定值Dth。并且,在将距离D保持为预定值Dth的状态下,控制XY平台110扫描刮板探针10。预定值Dth是根据糊料4的燃烧所产生的收缩量来确定的。选择的附图:图8

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