POLYCARBOXYLIC ACID RESIN, THERMOSETTING RESIN COMPOSITION USING THE SAME AND OPTICAL SEMICONDUCTOR DEVICE USING THE THERMOSETTING RESIN COMPOSITION AS ENCAPSULATION MATERIAL OR REFLECTOR

摘要

PROBLEM TO BE SOLVED: To provide a curing agent for thermosetting resin sufficiently increasing Tg of a cured article, excellent in moldability and less in coloration to the cured article, a thermosetting resin composition using the same and a semiconductor device using the same as an encapsulation material or a reflector.SOLUTION: There is provided a thermosetting resin composition containing polycarboxylic acid represented by the formula (1) and having viscosity in the range of 0.01 to 10 Pa s in the range of 100 to 200°C.SELECTED DRAWING: Figure 1