THERMOSETTING RESIN COMPOSITION INCLUDING POLYHYDRIC ALCOHOL COMPOUND, ACID ANHYDRIDE COMPOUND AND THERMOSETTING RESIN, POLYCARBOXYLIC ACID RESIN, THERMOSETTING RESIN COMPOSITION USING SAME, AND PHOTOSEMICONDUCTOR DEVICE USING EITHER ONE OF THE THERMOSETTING RESIN COMPOSITIONS AS SEALING MATERIAL OR REFLECTIVE MATERIAL

摘要

Provided are a thermosetting resin composition including a polyhydric alcohol compound (A) with three or more hydroxyl groups, an acid anhydride compound (B), and a thermosetting resin (C), a thermoset resin composition characterized by including a polycarboxylic acid (A) represented by formula (1) below, wherein the ICI cone-plate viscosity is within a range from 0.01 Pa∙s to 10 Pa∙s in a 100-200°C range, and a photosemiconductor device using either one of the thermosetting resin compositions as a sealing material or reflective material. (In formula (1), R¹ represents a 1-6C alkylene group, and R² represents a hydrogen atom, or a 1-6C alkyl group, or a carboxyl group. In formula (1), R¹ and R², pluralities of which exist, may be identical to or different from one another.)