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Co-integrated method of photonic devices on silicon photonics platform

机译:硅光子平台上光子器件的共集成方法

摘要

PROBLEM TO BE SOLVED: To provide a method for co-integrating a photonic device, a Ge waveguide built-in photodetector, and a hybrid III-V/Si laser on a Si-base photonic platform.;SOLUTION: A method includes the steps of: preparing an Si-base photonic substrate having an Si device including a patterned Si waveguide structure; accumulating a dielectric layer, for example, an SiO2 layer on a top part of the flattened Si-base photonic substrate; etching a groove on the dielectric layer at a proper etching depth, and exposing the patterned Si waveguide structure of the photonic substrate; selectively etching the exposed waveguide, creating a template for Ge growth, and leaving the thin Si layer as a seed layer for Ge growth; selectively growing Ge from the seed layer together with intensional Ge overgrowth; and flattening the Ge surface and leaving a Ge layer having reduced thickness of 100 nm-500 nm.;COPYRIGHT: (C)2013,JPO&INPIT
机译:要解决的问题:提供一种在Si基光子平台上将光子器件,内置Ge波导的光电探测器和混合III-V / Si激光器共集成的方法。解决方案:该方法包括以下步骤:制备具有硅器件的硅基光子衬底,所述硅器件包括图案化的硅波导结构;在平坦化的硅基光子衬底的顶部上堆积介电层,例如SiO 2 层;以适当的蚀刻深度在介电层上蚀刻出沟槽,并暴露出光子基板的图案化的Si波导结构;选择性地蚀刻暴露的波导,创建用于Ge生长的模板,并留下薄的Si层作为用于Ge生长的种子层;从晶种层选择性地生长锗,以及有意的锗过度生长;并平坦化Ge表面,留下厚度减少100 nm-500 nm的Ge层。;版权所有:(C)2013,日本特许厅&INPIT

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