OPTICAL SEMICONDUCTOR DEVICE LEAD FRAME, OPTICAL SEMICONDUCTOR DEVICE LEAD FRAME WITH RESIN, OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE LEAD FRAME MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an optical semiconductor device lead frame, an optical semiconductor device lead frame with a resin, an optical semiconductor device and an optical semiconductor device lead frame manufacturing method, which can prevent detachment of a resin due to a peel force in a vertical direction occurring in the optical semiconductor device lead frame used for a resin-molding optical semiconductor device in which a plurality of terminal parts each integrally having an internal terminal on a surface side and an external terminal on a rear face side of a metal substrate are arranged on one plane electrically independent of each other, and the internal terminals of the terminal parts and terminals of an optical semiconductor element are electrically connected, and a whole is resin-molded such that the rear face of the terminal part is exposed on the outside.;SOLUTION: The above-described problem is solved by forming recesses that improves adhesion with a resin on a surface side of an optical semiconductor device lead frame such that the inside of the recess is wider than the opening of the recess.;COPYRIGHT: (C)2016,JPO&INPIT