Fabrication method of a microfluidic chip having an electrode having the same height as the microchannel wall

摘要

A method of manufacturing a microfluidic chip is provided. The method includes providing a substrate having a surface covered with an electrically insulating layer, and obtaining a resist layer that covers one or more selected portions of the electrically insulating layer. The surface of the remaining portion of the electrical insulating layer is not etched with a resist layer so that at least the remaining portion of the electrical insulating layer is not covered with a resist layer and a recess or undercut or both are formed under the resist layer. And partially depositing a conductive layer on the etched surface so that the conductive layer reaches the created recesses and / or undercuts, and adjacent to the contiguous portion of the conductive layer Removing the resist layer to expose portions of the electrically insulating layer. The present invention is still further directed to a microfluidic chip obtainable by such a method. [Selection] Figure 10