FABRICATION OF MICROFLUIDIC CHIPS HAVING ELECTRODES LEVEL WITH MICROCHANNEL WALLS

摘要

The present invention is notably directed to method of fabrication of a microfluidic chip, comprising: providing a substrate, a face of which is covered by an electrically insulating layer; obtaining a resist layer covering one or more selected portions of the electrically insulating layer, at least a remaining portion of said electrically insulating layer not being covered by the resist layer; partially etching with a wet etchant a surface of the remaining portion of the electrically insulating layer to create a recess and/or an undercut under the resist layer; depositing the electrically conductive layer on the etched surface, such that the electrically conductive layer reaches the created recess and/or undercut; and removing the resist layer to expose a portion of the electrically insulating layer adjoining a contiguous portion of the electrically conductive layer. The present invention is further directed to microfluidic chips obtainable by such methods.