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Ag alloy sputtering target and method for producing Ag alloy film

机译:银合金溅射靶及银合金膜的制造方法

摘要

An Ag alloy sputtering target capable of forming an Ag alloy film excellent in environmental resistance (heat resistance and humidity resistance) and ion migration resistance is provided. One or more elements selected from Cu, Sn, Sb, Mg, In, Ti are contained in a total range of 0.1 atomic% to 15.0 atomic%, and S is contained in the range of 0.5 atomic ppm or more and 200 atomic ppm or less, and the balance is composed of Ag and inevitable impurities. [Selection figure] None
机译:提供了一种能够形成耐环境性(耐热性和耐湿性)和抗离子迁移性优异的Ag合金膜的Ag合金溅射靶。选自Cu,Sn,Sb,Mg,In,Ti的一种或多种元素的合计含量为0.1原子%至15.0原子%,并且S的含量为0.5原子ppm以上至200原子ppm或较少,其余部分由Ag和不可避免的杂质组成。 [选择图]无

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