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Ag alloy sputtering target and method for producing Ag alloy film
Ag alloy sputtering target and method for producing Ag alloy film
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机译:银合金溅射靶及银合金膜的制造方法
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摘要
An Ag alloy sputtering target capable of forming an Ag alloy film excellent in environmental resistance (heat resistance and humidity resistance) and ion migration resistance is provided. One or more elements selected from Cu, Sn, Sb, Mg, In, Ti are contained in a total range of 0.1 atomic% to 15.0 atomic%, and S is contained in the range of 0.5 atomic ppm or more and 200 atomic ppm or less, and the balance is composed of Ag and inevitable impurities. [Selection figure] None
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