首页> 外国专利> FLATTENING CORRECTION MECHANISM FOR INSPECTED CIRCUIT BOARD IN CIRCUIT BOARD INSPECTION DEVICE

FLATTENING CORRECTION MECHANISM FOR INSPECTED CIRCUIT BOARD IN CIRCUIT BOARD INSPECTION DEVICE

机译:电路板检查装置中的被检查电路板的平动校正机构

摘要

PROBLEM TO BE SOLVED: To provide a flattening correction mechanism that corrects wrinkles formed on a flexible board.;SOLUTION: A device main body 12 comprises a circuit board suction mechanism 22 for sucking and retaining an inspected circuit board P and a probe movement mechanism 32 for inspection having a pair of movable arms 34 and 37 for moving a pair of inspection probes independently and having them contact the circuit board P. In an inspection head 35 provided on one movable arm 34 of the probe movement mechanism 32 for inspection, displacement detection means 43 is arranged for detecting a position of a non-flat portion W formed on the circuit board P. In an elevation part 38a of an inspection head 38 provided on the other movable arm 37, displacement correction means 45 is arranged that has a roller 47 for rolling in contact with the detected non-flat portion W and flattening it. Thus flattening of the non-flat portion W of the circuit board P is made possible via a flattening correction mechanism 42 consisting of the displacement detection means 43 and the displacement correction means 45.;SELECTED DRAWING: Figure 3;COPYRIGHT: (C)2016,JPO&INPIT
机译:解决的问题:提供一种矫正在柔性板上形成的皱纹的扁平化校正机构。解决方案:装置主体12包括用于吸引并保持被检查的电路板P的电路板吸引机构22和探针移动机构32。用于检查的检查装置具有一对可动臂34和37,其用于使一对检查探针独立地移动并使它们接触电路板P。在设置在用于检查的探针移动机构32的一个可动臂34上的检查头35中,进行位移检测装置43被布置用于检测形成在电路板P上的非平坦部分W的位置。在设置在另一个可动臂37上的检查头38的升高部分38a中,布置了具有辊的位移校正装置45。用于与检测到的非平坦部分W接触滚动并使其平坦化的图47所示的部分。因此,通过由位移检测装置43和位移校正装置45构成的平坦化校正机构42,可以使电路板P的非平坦部分W变平。;所选择的附图:图3;版权:(C)2016 ,JPO&INPIT

著录项

  • 公开/公告号JP2016020821A

    专利类型

  • 公开/公告日2016-02-04

    原文格式PDF

  • 申请/专利权人 HIOKI EE CORP;

    申请/专利号JP20140143973

  • 发明设计人 KONDO HISAYUKI;

    申请日2014-07-14

  • 分类号G01R31/28;H05K3/00;

  • 国家 JP

  • 入库时间 2022-08-21 14:44:10

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