WHITE CURABLE COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD FOR PREPARING WHITE CURABLE COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, MOLDING FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a white curable composition for optical semiconductor devices, which can enhance compressive strength and mold releasability from a metal mold and can hardly lower the light intensity even when the optical semiconductor device is obtained by using the white curable composition for optical semiconductor devices and is energized and used under a severe condition.;SOLUTION: The white curable composition for optical semiconductor devices contains an epoxy compound, an acid anhydride curing agent, a white pigment, a filler other than the white pigment, and a curing accelerator. Carbon-carbon bonds of the acid anhydride curing agent comprise only single bonds. A calorific value since curing is started until curing is completed is 20-80 J/g and an endothermic value since melting is started until melting is completed is 0.1-15 J/g when measured by a differential scanning calorimeter.;SELECTED DRAWING: None;COPYRIGHT: (C)2016,JPO&INPIT