Polishing monitoring method, polishing monitoring equipment, and polishing equipment

摘要

PROBLEM TO BE SOLVED: To provide a method capable of accurately monitoring a progress of polishing and detecting an exact end point of polishing.;SOLUTION: A method comprises the steps of: irradiating a substrate with light while polishing the substrate; receiving reflection light from the substrate; measuring intensity of the reflection light for each wavelength; generating a spectrum indicating relation between the intensity and the wavelength from a measured value of the intensity; calculating an amount of change in the spectrum per a predetermined period of time; accumulating the amount of change in the spectrum over polishing time to calculate an accumulated amount of change in the spectrum; and monitoring a progress of substrate polishing on the basis of the accumulated amount of change in the spectrum.;COPYRIGHT: (C)2015,JPO&INPIT