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GaN COMPOSITE SUBSTRATE AND GaN SELF-SUPPORTING SUBSTRATE, AND PREPARATION METHOD THEREFOR

机译:GaN复合基体和GaN自支撑基体及其制备方法

摘要

PROBLEM TO BE SOLVED: To provide a GaN composite substrate and a GaN self-supporting substrate in which dislocation is reduced as compared to the conventional ones.SOLUTION: A preparation method for a GaN composite substrate 10 includes: an alumina layer forming step of forming a polycrystalline alumina layer on a template substrate formed by epitaxially forming a GaN layer 2 on a ground substrate 1 so as to make a (0001) plane parallel with the substrate surface; a communication recession forming step of discretely forming a plurality of openings 3h on the polycrystalline alumina layer and forming a plurality of recessions 2h each communicating with each of the plurality of openings 3h on the GaN layer 2, thereby forming a plurality of communication recessions H in each of which one opening 3h and one recession 2h communicate with each other; and a thick film layer forming step of setting the polycrystalline alumina layer having the plurality of openings 3h formed therein as a mask layer 3 and setting the GaN layer 2 having the plurality of recessions 2h formed therein as a seed crystal layer, and then, while making the plurality of recessions 2h as starting points of growth, forming a GaN thick film layer 4 covering the entire upper surface of the mask layer 3 by the Na flux method.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种GaN复合衬底和GaN自支撑衬底,与传统衬底相比,该GaN复合衬底和位错减少了位错。GaN复合衬底10的制备方法包括:形成氧化铝层的步骤在模板基板上的多晶氧化铝层,该模板基板是通过在接地基板1上外延形成GaN层2而形成的,从而使(0001)面与基板表面平行。连通凹部形成步骤,其在多晶氧化铝层上离散地形成多个开口3h,并在GaN层2上形成分别与多个开口3h中的每一个连通的多个凹部2h,从而形成多个连通凹部H in。开口3h和凹部2h分别连通。厚膜层形成步骤,将形成有多个开口3h的多晶氧化铝层设置为掩模层3,将形成有多个凹部2h的GaN层2设置为籽晶层,然后,以多个凹槽2h为生长起点,通过Na助熔剂法形成覆盖掩模层3整个上表面的GaN厚膜层4.图1

著录项

  • 公开/公告号JP2016069224A

    专利类型

  • 公开/公告日2016-05-09

    原文格式PDF

  • 申请/专利权人 NGK INSULATORS LTD;

    申请/专利号JP20140200244

  • 申请日2014-09-30

  • 分类号C30B29/38;C30B19/12;

  • 国家 JP

  • 入库时间 2022-08-21 14:43:05

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