首页> 外国专利> quantum cascade semiconductor laser, laser device and a method of manufacturing a quantum cascade semiconductor laser

quantum cascade semiconductor laser, laser device and a method of manufacturing a quantum cascade semiconductor laser

机译:量子级联半导体激光器,激光器装置和制造量子级联半导体激光器的方法

摘要

PROBLEM TO BE SOLVED: To inhibit a solder material from rising up on a side surface.;SOLUTION: A quantum cascade semiconductor laser 1 includes: a semiconductor layer 20 including a lower clad layer 11, a core layer 13, and an upper clad layer 15; an insulation layer 41 provided on a main surface 16a of the semiconductor layer 20; and an upper electrode E1 connecting with the main surface 16a through an opening 41a of the insulation layer 41. The semiconductor layer 20 is formed by a first region 20a, a second region 20b, and a third region 20c, which are sequentially disposed along one direction perpendicular to a normal axis NV. Solder seal-in grooves 32 are respectively provided along the other direction perpendicular to the normal axis NV and the one direction at the first region 20a and the third region 20c. The insulation layer 41 is provided on the main surface 16a and the solder seal-in grooves 32, and the first region 20a and the third region 20c are located at positions lower than the second region 20b.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:抑制焊料在侧面上上升。解决方案:量子级联半导体激光器1包括:半导体层20,其包括下部包层11,芯层13和上部包层15;绝缘层41设置在半导体层20的主表面16a上;半导体层20由沿着第一绝缘层41的开口41a顺序地设置的第一区域20a,第二区域20b和第三区域20c形成。垂直于法线轴NV的方向。在第一区域20a和第三区域20c分别沿着与法线NV垂直的另一方向和一个方向设置有焊料密封槽32。绝缘层41设置在主表面16a和焊料密封槽32上,并且第一区域20a和第三区域20c位于低于第二区域20b的位置。;版权所有:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP5810720B2

    专利类型

  • 公开/公告日2015-11-11

    原文格式PDF

  • 申请/专利权人 住友電気工業株式会社;

    申请/专利号JP20110168686

  • 发明设计人 橋本 順一;

    申请日2011-08-01

  • 分类号H01S5/022;H01S5/34;

  • 国家 JP

  • 入库时间 2022-08-21 14:42:09

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号