Current application method and the current application device

摘要

PROBLEM TO BE SOLVED: To provide a current application method and a current application device capable of preventing destruction of a semiconductor resulting from residual electricity in the semiconductor.SOLUTION: A current application method for applying currents to a power semiconductor 100 that includes a first signal pin contact region 102 to which a first current is applied; and a contact body contact region 101 that is electrically connected to the first signal pin contact region 102 and to which a second current is applied, comprises: a step S1 of bringing a first signal pin 32 of a probe device 1 to contact the first signal pin contact region 102, and eliminating residual electricity in the first signal pin contact region 102 and the contact body contact region 101; and steps S3 and S4, after step S1, of bringing a contactor 21 of a contact body 2 of the probe device 1 into contact with the contact body contact region 101, and applying the first current and the second current.