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Conductive paste for the silver powder and a conductive paste

机译:用于银粉的导电胶和导电胶

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a silver powder capable of manufacturing, without using, as reductants, polyhydric phenols such as hydroquinone, etc., a silver powder having an average particle diameter D50 of 0.1 μm or above and below 1 μm and a maximal particle diameter Dmax of 4 μm or below; and the silver powder.;SOLUTION: In a method for manufacturing a silver powder wherein silver particles are reduced and deposited by adding a reductant to an aqueous reaction system including silver ions, at least one type selected from the group consisting of fatty acids, fatty acid salts, and fatty acid esters is added to the aqueous reaction system prior to the addition thereto of the reductant, and a chelating agent is added to the aqueous reaction system following the addition thereto of the reductant.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种制造银粉的方法,该方法无需使用还原剂即可生产平均粒径为D 50 的银粉作为还原剂,而该多酚如对苯二酚等。 0.1μm以上且小于1μm,最大粒径D max 为4μm以下;解决方案:在一种制造银粉的方法中,其中通过将还原剂添加到包含银离子的水性反应体系中来还原和沉积银颗粒,其中至少一种选自脂肪酸,脂肪族和脂肪族。在添加还原剂之前先将其盐和脂肪酸酯添加至水性反应体系中,然后在添加还原剂之后将螯合剂添加至水性反应体系中。;版权:(C)2014,日本特许厅

著录项

  • 公开/公告号JP5890387B2

    专利类型

  • 公开/公告日2016-03-22

    原文格式PDF

  • 申请/专利号JP20130270286

  • 发明设计人 井上 賢;野上 徳昭;

    申请日2013-12-26

  • 分类号B22F1/00;B22F1/02;B22F9/24;H01B5/00;H01B1/00;H01B1/22;

  • 国家 JP

  • 入库时间 2022-08-21 14:41:00

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