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Grilled tofu tofu firing method for the preparation for the firing device, and grilled tofu manufacturing

机译:烤制豆腐的烧制方法,烧制装置的准备以及烤制豆腐的制造

摘要

PROBLEM TO BE SOLVED: To provide a baking device for soybean processed food suppressing blistering of a surface when baking a soybean processed food.;SOLUTION: A baking device for soybean processed food includes a conveyance part 20A moving in a conveyance direction D on a base surface S1; a supporting part 30 attached to the conveyance part and for supporting a soybean processed food T; a low temperature heating part 40A arranged on an upstream side D2 in the conveyance direction while facing the base surface, and for heating the supporting part; and a high temperature heating part 50A for heating the supporting part, arranged on the base surface on the same side as the low temperature heating part at downstream in the conveyance direction while facing the base surface. A temperature to which the supporting part reaches by heating by the high temperature heating part is set higher than a temperature to which the supporting part reaches by heating by the low temperature heating part. The supporting part is formed from stainless steel, and the surface of a soybean processed food supporting side is formed by mirror finish.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种用于抑制大豆加工食品在烘焙大豆加工食品时表面起泡的烘焙装置;解决方案:用于大豆加工食品的烘焙装置包括在基座上沿输送方向D移动的输送部20A。表面S1;支撑部30,其安装在输送部上,用于支撑大豆加工食品T。低温加热部40A配置在输送方向的上游侧D2且与底面相对,用于加热支承部。高温加热部50A在与基体表面相对的状态下,在输送方向的下游侧配置在与低温加热部相同的一侧的基面上,用于加热支撑部。支撑部通过高温加热部的加热达到的温度被设定为高于支撑部通过低温加热部的加热达到的温度。支撑部分由不锈钢制成,大豆加工食品支撑面的表面通过镜面加工形成。;版权所有:(C)2013,JPO&INPIT

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