Resin-encapsulated semiconductor device, the resin sealing mold, production method and the lead frame of the resin-encapsulated semiconductor device

摘要

PROBLEM TO BE SOLVED: To enable attachment positions of a heat radiation fin to be selectable, thereby improving mounting flexibility when a resin seal type semiconductor device is mounted on a substrate of an electronic apparatus or the like.SOLUTION: A resin seal type semiconductor device 200A includes a body 210 in which a semiconductor element and a semiconductor element attachment portion are sealed with a resin and outer leads 121 to 124 extending from the body 210 to an exterior portion in a predetermined direction. In the body 210, a first screw insertion part 300 and a second screw insertion part 400 are respectively provided on different surfaces of the body 210 for attaching a heat radiation fin to a rear surface or an upper surface of the body 210.