Method of manufacturing a self-precipitation copper for the surface treatment agent and a resin film with a copper-containing substrate

摘要

The present invention aims to provide an adhesion-corrosion resistance and electrical properties with excellent film can be formed on the copper material by autodeposition, autodeposition type copper surface treatment agent having excellent liquid stability to. Autodepositing for copper surface treating agent of the present invention, the 1 to 60 parts by weight of a water-soluble or water-dispersible polymer, and a solvent composed mainly of water of 30 to 99 parts by weight, of 0.01 to 5 parts by weight and a copper complexing agent, is in the range of oxidation-reduction potential of -500~ + 200mV (vs.SHE) when the pH3.0.