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Structures and Methods with Reduced Sensitivity to Surface Charge

机译:对表面电荷敏感性降低的结构和方法

摘要

The present application provides (in addition to more broadly applicable inventions) improvements which are particularly applicable to two-sided power semiconductor devices which use bipolar conduction. In this class of devices, the inventor has realized that two or three of the four (or more) semiconductor doping components which form the carrier-emission structures and control structures in the active device (array) portion of a two-sided power device can also be used, with surprising advantages, to form field-limiting rings around the active arrays on both surfaces. Most preferably, in some but not necessarily all embodiments, a shallow implant of one conductivity type is used to counterdope the surface of a well having the other conductivity type. This shallow implant, singly or in combination with another shallow implant of the same conductivity type, works to shield the well from the effects of excess charge at or above the surface of the semiconductor material.
机译:本申请提供了(除了更广泛适用的发明之外)改进,其特别适用于使用双极导电的两侧功率半导体器件。在这类器件中,发明人已经意识到,在两侧功率器件的有源器件(阵列)部分中形成载流子发射结构和控制结构的四个(或更多个)半导体掺杂组件中的两个或三个可以还具有令人惊讶的优点的是,它们还用于在两个表面上的有源阵列周围形成场限制环。最优选地,在一些但并非全部实施例中,使用一种导电类型的浅注入物来对具有另一种导电类型的阱的表面进行掺杂。该浅注入物单独地或与相同导电类型的另一浅注入物组合,用于保护阱免受半导体材料表面处或上方的过量电荷的影响。

著录项

  • 公开/公告号US2016133694A1

    专利类型

  • 公开/公告日2016-05-12

    原文格式PDF

  • 申请/专利权人 IDEAL POWER INC.;

    申请/专利号US201614997284

  • 发明设计人 RICHARD A. BLANCHARD;

    申请日2016-01-15

  • 分类号H01L29/06;H01L29/73;H01L29/739;

  • 国家 US

  • 入库时间 2022-08-21 14:38:53

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