APPARATUS FOR ASSESSMENT OF VOIDS IN SOLDER AND METHOD FOR ASSESSMENT OF VOIDS IN SOLDER

摘要

A void evaluation apparatus in a solder includes:an evaluation function calculation unit for calculating a solder evaluation function by using that a pixel value pi contained in the voids is set to 1 and the pixel value pi not contained in the voids is 0 for each pixel constituting an image in the solder and by using a weight function w(ri), which is maximum at a solder center (ri=0) and is 0 at a maximum radius (ri=r0) for a distance ri from the solder center; anda void evaluation unit for evaluating that the influence of voids is larger as the evaluation function is relatively larger for the each solder.; $$ \frac{\sum _{i=1}^Nw\left(r_i\right)p_i}{\sum _{i=1}^Nw\left(r_i\right)}\times 100$$ ;i: pixel number (1−N);pi: pixel value (0 or 1);w(ri): weighting function